ION SLICED LITHIUM NIOBATE THIN FILMS

Partow manufactures and provide TFLN substrates based on crystal ion slicing of lithium niobate wafers. The process uses ion implantation to break the bonds in the lithium niobate crystal. The implanted crystal is then bonded using the company SAB bonding technology to a handle substrate and a thin layer of lithium niobate is transferred to the handle substrates using crystal ion slicing technique. A final chemical-mechanical polishing step smoothens the surface of the bonded thin film wafer. Currently, the company produces customized TFLN substrare based on customer needs.