Thick Films 2017-07-18T11:57:48+00:00

THICK FILMS

For thicker films between several microns to several tens of microns, we provide wafer bonding and thinning service.The top wafer can be various crystals such as Lithium niobate, Lithium tantalate, Quartz, Silicon and etc. The thinning is achieved by wafer grinding and polishing. Final thickness for the thick film is several microns with about +-1 micron uniformity.

Thick film crystal layer on silicon product specification

Part Number LN-X- 5000-2000- 75-100 LN-X-xxx-xxx-xx-100
Description Various crystals (LN, LT, …) on silicon dioxide on silicon
Top crystal layer
Parameter Standard Custom Order
Orientation X-cut X-cut, Y-cut or Z-cut
Primary Flat (on LN film) +z TBD
Secondary Flat (on LN film) -Y TBD
Lithium Niobate Film Diameter 75 mm 75 mm – 100 mm
Thickness Range 5 μm > 5 μm
Thickness Uniformity ±0.5 μm < 15%
Surface Roughness < 1 nm < 1 nm
Defective Area < 20% < 20%
Intermediate SiO2 layer
Parameter Standard Custom Order
Thickness Range 2,000 nm 0 nm – 2,000 nm
Thickness Uniformity < 3% <15%
Silicon Substrate
Parameter Standard Custom Order
Substrate Thickness 0.525 mm 0.1 – 1 mm
Substrate Diameter 100 mm 100
Substrate Resistivity > 5000 ohm-cm 0 – 20,000 ohm-cm

Custom thick film bonding and thinning service

Parameter Substrate 1 Substrate 2
Material Silicon Silicon, Lithium niobite, Quartz, GaAs, InP …..
Diamater 25 mm, 100 mm 25 mm, 100 mm
Thickness 0.5 mm > 5 μm
Surface roughness < 0.5 nm < 0.5 nm