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- Partow received STTR phase II award to develop room temperature wafer bonding equipment
- We will be in IEEE MTT-S International Microwave Symposium (IMS2024), Booth #212
- Please visit our booth at IRMMW-THz 2023
- Partow received STTR phase I award to develop room temperature wafer bonding equipment
- Partow will demonstrate its high resolution Electro-optic Electric field sensor in Photonic West 2022
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Recent Posts
- Partow received STTR phase II award to develop room temperature wafer bonding equipment
- We will be in IEEE MTT-S International Microwave Symposium (IMS2024), Booth #212
- Please visit our booth at IRMMW-THz 2023
- Partow received STTR phase I award to develop room temperature wafer bonding equipment
- Partow will demonstrate its high resolution Electro-optic Electric field sensor in Photonic West 2022
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